Huawei launches a new strategy to develop chips by 2031, defying US sanctions.

Huawei has launched a new strategy, developing high-performance chips with transistor density equivalent to a 1.4-nanometer manufacturing process by 2031, defying US sanctions.

May 25, 2569 at 09.54:XNUMX a.m., Reuters reported that Chinese company Huawei Technologies has revealed that it expects to be able to design high-performance chips with transistor densities equivalent to a 1.4-nanometer manufacturing process by 2574. Despite still facing sanctions from the United States that limit access to the world's advanced chip manufacturing technology.

The prediction was revealed on Monday, with Huawei stating it was part of a new concept called… “Tau Scaling Law” The company views this as a new approach to developing next-generation chips, at a time when the semiconductor industry can no longer rely solely on miniaturizing transistors as it did in the past.

He Tingbo, President of Huawei's Semiconductor Business and Director of the company's Scientist Committee. The concept was unveiled at the IEEE International Symposium on Circuits and Systems (ISCAS) 2026 in Shanghai under the theme "New Semiconductor Path in Practice".

Although Huawei has not yet released independently verified performance data, the 1.4nm target is extremely important, as it is expected to be at the forefront of the global chip industry by the end of this decade.

Currently, many believe that China has limited opportunities to develop advanced chip manufacturing technologies through traditional processes due to US restrictions on the export of advanced lithography machinery and other key semiconductor technologies to China.

Huawei states that the Tau Scaling Law concept focuses on reducing signal transmission and data transfer times within chips and computing systems, rather than relying solely on transistor miniaturization. If successful, this approach could help the company increase chip performance and density, even though China still faces limitations in accessing the world's most advanced chip manufacturing equipment.

Furthermore, Huawei revealed that its new Kirin series chips, scheduled for release in late 2569, will be the first products to utilize a new architecture called LogicFolding, which the company states will significantly reduce internal chip connections and improve performance.

The company also stated that over the past six years, Huawei has designed and manufactured 381 chip models under the Tau Scaling Law concept for use in various industries, including smartphones and AI computing.

refer : reuters.com

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